The Pressure Sensitive Tape Council (PSTC) is internationally recognized for its leadership in promoting the manufacture of tape products high in quality and performance. In line with that mission, PSTC has selected the presentations listed below for its TECH XXVII Global Conference, May 12-14, 2004. Selected presentations are given orally at the conference and published in the conference proceedings for year-to-year reference.
As pressure sensitive tape applications extend into multiple industries and every home, PSTC seeks to share leading edge ideas in processes, materials, technology, test methods and environmental issues as they relate to advancing the science of pressure sensitive adhesives.
Plan now to attend - and learn from leaders in the industry.
Statistical Evaluation of Laboratory Data
James August, American Biltrite, Inc.
Factors Influencing the Use of Carton Sealing Tape in the Asia Pacific Region
James Costanzo, Rohm and Haas Company
Pushing the Envelope: Designing with Semi-Structural PSAs
David Dillard, Virginia Tech
Understanding and Controlling Product Anisotropy and Its Evolution in Hot Melt Coating Processing of Pressure Sensitive Adhesive Materials
Thilo Dollase, tesa AG, Germany
The Mechanical and Molecular Nature of PSAs as Damping Materials
David Drath, Roush Industries, Inc.
Assessment and Prediction of Long-Term Properties of Pressure Sensitive Tapes in Semi-Structural Applications
Paul Geiss, University of Kaiserslautern, Germany
The Effect of Hindered Phenol Stabilizers on Oxygen Induction Time (OIT) Measurements, and the Use of OIT Measurements to Predict Long-Term Thermal Stability
Philip Jacoby, Mayzo, Inc.
Revisiting Dynamic Lap Shear Method for Evaluating Tapes
Marc Johnson, Texture Technologies Corp.
Designing Test Methods for Medical PSA Devices
Tony Kaufman, 3M
Newly Designed SIS Block Copolymers for Pressure Sensitive Adhesives
Tetsuaki Matsubara, Zeon Corporation
Interfacial Diffusion of Fluids in Pressure Sensitive Adhesives
Emmett O'Brien, Virginia Tech
A Novel Way to Reversibly Detackify PSAs Using Thermoresponsive Copolymers
John O'Mahoney, Adhesives Research, Ireland
Acrylic Hot Melt Pressure Sensitive Adhesives
Charles Paul, National Adhesives
Thermally Activated Self-Adhesion Processes in Contact Mechanics Measurements Using Pressure Sensitive Adhesive-Like Networks
Alphonsus Pocius, 3M
The Right Choice. Fluorescent UV Weathering Devices (QUV) vs. Xenon Weathering Devices (Q-Sun)
Jeffrey Quill, Q-Panel Lab Products
New Release Coating Chemistry
Robin Righettini, Omnova Solutions
Radiation Curable Pressure Sensitive Adhesives
Graeme Roan, National Starch & Chemical Company
Rheological Properties of High-Speed Roller
P. Rolfe, Bohlin Instuments
Plotting of Self-Adhesive Filmic Materials - An Investigation into What Determines the Perfect Plot
Evert Smit, National Starch in Zutphen
New Oligomers Designed to Enhance Formulating UV/EB PSAs
Deborah Smith, Sartomer Company
Hand Sectioning and Identification of Pressure Sensitive Tapes
Mary Stellmack, McCrone Associates
PSA Challenges and Applications in Semiconductor Manufacturing
Laurent Vesier, Rodel, Inc.
Electron Beam Tape Processing at Low Voltages
Douglas Weiss, 3M
Nano Technology
Speaker TBD, Rohm and Haas Company
Topic TBD
Speaker TBD, Afera
